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Our facility has the following equipment for hybrid-production:
Die Mounting of chip, Wedge bonding, Ribbon bonding, Gap welding, Die shear / Bond pull and Electrical test.
Electrical tests are made routinely along the manufacturing flow on fully automated test stations. We perform ICT with a tester designed for high volume production tests.
Our environmental-facility has equipment for vibration, shock, thermal cycling and thermal vacuum testing. EMC tests can be performed in a nearby contracted facility.
We have excellent relations and competence in the complete chain of activities in handling components: Specification, Procurement, Incoming inspection, Failure analysis, etc. |